Work with global cross-functional teams on new silicon development. Develop and debug probe and final-test solutions and hardware, write burn-in/reliability stress code, support silicon characterization, initial data analysis, customer sample deliveries, and reliability qualification. Drive yield, test time, and coverage improvements while collaborating with Design, Applications, and Manufacturing teams.
Job Description:
- Work with worldwide cross-functional teams on new silicon development from early phases of product definition onwards.
- Develop and support debug of Probe and FT test solutions, including Probe and FT test hardware designs, that result in both product cost and product quality requirements being met, securing the Automotive Zero defect(low PPM) requirement.
- Develop or contribute to Burn-in and reliability stress code for product qualification.
- Support silicon Matrix Characterization plus initial data analysis, customer sample deliveries and product reliability qual.
- Apply knowledge and skills to help drive Product yields, test times and test coverage, to industry benchmark levels.
- Learn best known problem solving approaches and methods to work with Design, Applications, and Manufacturing teams to solve New Product introduction challenges.
- Besides project execution, there are different work groups on improving test methodologies and test efficiency. If you have good ideas or willing to learn more, there is always room for development.
Qualifications:
- Bachelor degree or above, EE, communication or Automatization major.
- Good level on oral and written English, CET4 and above…
- Good communication skill and team work spirit, willing to learn, take on challenges and self-motivated.
More information about NXP in Greater China...
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